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It etches locally and with high precision within the substrate surface.
Scia Systems GmbH was established by key staff who developed the software and hard wafers for the ion beam trimming (trimming processing, IBF) device IonScan from Roth&Rau AG and MicroSystems GmbH. Scia Systems develops unique and proprietary cutting-edge ion beam and plasma technologies, handling equipment from research and development to mass production.
Mechanical clamp or electrostatic chuck compatible! Sub-nanometer etching mechanism.
The "scia Trim 200" is an ion beam trimming device that controls film thickness etching with high precision and high throughput. It supports wafer substrates up to 200mm, improving yield. Additionally, the process is ion beam trimming (IBT). Please feel free to consult us when needed. 【Features】 ■ Supports wafer substrates up to 200mm ■ Yield improvement ■ Film thickness etching control with high precision and high throughput ■ Compatible with mechanical clamps or electrostatic chucks ■ Sub-nanometer etching mechanism *For more details, please refer to the PDF document or feel free to contact us.
